Remote Head Airflow Sensor Meets Form Factor Challenges

February 16, 2023 | Posted By: Degree Controls Inc.

Constantly working to improve products and processes, organizations are deploying sensors to monitor air velocity and identify airflow issues before quality and efficiency are affected. For applications that present space or configuration challenges, Degree Controls’ remote head airflow sensors deliver measurement performance with the flexibility users need.

F-Series remote head sensors are air velocity measurement devices where the sensing element and the sensor electronics are in separate housings and can be located independently. This is advantageous where the sensing area is too small for a classic F-Series probe-style sensor and when there is a need to avoid EMI or vibration in an industrial setting.

Remote head airflow sensor
Remote Head Airflow Sensor, Multiple Sensor Head Styles

With a wide range of sensor heads, the remote head platform supports an array of application requirements for sensor size, mounting style, and sensing technique. Remote head airflow sensors are configured to order, saving time, cost, and effort for the user. Options for sensor supply voltage accommodate building automation systems and industrial control applications, and choices for analog or digital signal outputs facilitate integration with PLCs and flow control devices. Sensor velocity range is 30 to 4,000 fpm, and electronics are conformal coated for environmental protection.

A 1m cable connects the sensor head with the electronic enclosure allowing the enclosure to be mounted in a location which is more easily accessed.

With a remote board mount sensor users can embed the compact sensor head into a printed circuit board assembly for real time air velocity and temperature measurements. With segregation of the sensing element and sensor electronics, valuable space on the pcb is not used up with sensor electronics. DegreeC board mount sensor products can be mounted onto a PCB assembly by means of a socket insertion procedure or no‐clean soldering process.

IPC-A-610 provides requirements for acceptance of electronic assemblies and specifies how to achieve a good solder joint for through-hole components.

How may we help?