As managers monitor raised floor data centers and identify hot spots that need to be addressed, they often turn to the HotSpotr™ HT-510 thermostatically controlled air mover to solve cooling issues. The HT-510 is an underfloor air mover, DC fan tray cooling tile. It delivers a variable volume of cooling air upward, to the inlet side of server racks, using input from supplied thermocouples to adjust fan speed.
The HotSpotr™ is a reliable, self-contained unit. HT-510 underfloor air movers can be added throughout data centers, as needed, to eliminate hot spots and maintain safe rack temperatures. Configured with or without attached 24”x24” ASM 56% open area perforated tile, the HT-510 is quick and easy to install with no interruption to data center operation:
- Mount at least one of the two included temperature sensors near the top and front of the rack to be monitored. Sensors are attached to adhesive-backed mounting pads for convenience.
- Mount the fan tray within the flooring system, and power on. The plug and play HotSpotr™ immediately delivers cooling airflow where needed.
The HT-510’s eight-fan array provides cooling redundancy, adding yet another level of reliability in the data center. If one fan fails, the others will compensate for the loss of flow. Additionally, the alarm output allows building control systems to monitor HotSpotr™ status remotely, and the temperature range for fan speed control may be adjusted by the user. Supplement your underfloor air distribution system, protect critical IT equipment, and improve CRAC (Computer Room Air Conditioners) efficiency with the HotSpotr™ underfloor air mover to provide cool air where and when it’s needed.
Explore our other airflow and thermal management solutions for data centers. For example, bi-directional air velocity sensors measure and output airflow direction to ensure the integrity of flow in hot aisle/cold aisle data centers, and adjustable sensing arrays quantify airflow to server racks.
Note: The ASHRAE Datacom Series provides guidance for data center cooling and related subjects. Thermal Guidelines for Data Processing Environments, the first book of the series, was updated just this year.